Sputtering targets can be divided into rotary targets and planar targets according to their shapes.
Planar targets mainly refer to circular targets and rectangular targets with a certain thickness, they are prepared mainly by vacuum melting, powder metallurgy and hot pressed sintering in moulds; The rotary target is a magnetron target made into a cylindrical shape with a stationary magnet inside, which rotates at a slow speed and the standard manufacturing methods of rotary targets are plasma spraying onto the base tubes, casting, and extrusion of the complete assembly.
Rotary Sputtering Target VS Planar Sputtering Target
|Rotary Sputtering Target||Planar Sputtering Target|
|Situation||Continuous sputtering processesProduction type workLarge area coating||Prototype work Elemental experimentation|
|Cost Effective||For high volume production||For a small amount of production|
|Surface||Rotary targets generally have more surface area per given length than planar targets.|
|Runtime||Rotary targets generally have longer runtime than planar targets.|
|Utilization Rate||Up to 80%||Up to 30%|
Quken offers a variety of different shapes of sputtering targets, such as planar sputtering targets and rotary sputtering targets.