Magnetron sputtering is one of physical vapor deposition (PVD) processes developed in the 1970s. The planar sputtering targets and rotary targets are the most common magnetron sputtering cathodes. (Please refer to Rotary Sputtering Target VS Planar Sputtering Target)
The working principle of magnetron sputtering is to use the electrons behind the negative cathode to capture the electrons on the negatively charged target material, add a magnetic field, it constraints on the charged particles will increase the plasma density and accelerate the deposition speed, so as to make the particles of sputtering material sputter out and deposit on the substrate to form a thin film.
Magnetron sputtering source can be divided into balanced source and unbalanced source.
|Balanced Source||Unbalanced Source|
|Feature||Uniform coating||Strong bonding force|
|Application||Semiconductor optical films||Wear resistant decorative films|
Magnetron sputtering has the advantages of high speed, low temperature, and low damage, which makes it widely used in many fields.
The applications of magnetron sputtering are listed as below:
|Functional Films||High Temperature Superconducting Thin Films|
|Memory Alloy Thin Films||Decorative Fields|
|Microelectronics Fields||Solar Cells|