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Introduction of Magnetron Sputtering

Magnetron sputtering is one of physical vapor deposition (PVD) processes developed in the 1970s. The planar sputtering targets and rotary targets are the most common magnetron sputtering cathodes. (Please refer to Rotary Sputtering Target VS Planar Sputtering Target)

The working principle of magnetron sputtering is to use the electrons behind the negative cathode to capture the electrons on the negatively charged target material, add a magnetic field, it constraints on the charged particles will increase the plasma density and accelerate the deposition speed, so as to make the particles of sputtering material sputter out and deposit on the substrate to form a thin film.

Magnetron sputtering source can be divided into balanced source and unbalanced source.

Balanced SourceUnbalanced Source
FeatureUniform coating Strong bonding force
ApplicationSemiconductor optical filmsWear resistant decorative films

Magnetron sputtering has the advantages of high speed, low temperature, and low damage, which makes it widely used in many fields.

The applications of magnetron sputtering are listed as below:

Functional FilmsHigh Temperature Superconducting Thin Films
Memory Alloy Thin FilmsDecorative Fields
Microelectronics FieldsSolar Cells

Quken offers a variety of magnetron sputtering cathodes, such as planar sputtering targets and rotary sputtering targets.

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