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Introduction of E-Beam Evaporation

E-Beam, Electron Beam Evaporation, a thermal evaporation process, is a most common type of Physical Vapour Deposition (PVD) process. (Reference: Introduction of Physical Vapour Deposition and Thermal Evaporation VS Sputtering Deposition)

E-Beam Evaporation refers to the process in which the target used as a coating is bombarded by an electron beam from a charged tungsten filament, then vaporizes and converts it into a gaseous state. In a high vacuum chamber, gaseous atoms or molecules are deposited on the material to be coated to form a thin film coating.

Here are two significant advantages of E-Beam Evaporation:

  1. It is suitable for metals with high melting points, the deposition rates from 0.1 to 100nm/min allows it to produce a higher density film coating.
  2. E-Beam Evaporation has high utilization efficiency in a lower degree of contamination. Concentrating the energy on the targets helps reduce the possibility of heat damage to the substrate.

The applications of E-Beam Evaporation are included but not limited to the followings:

High Performance AerospaceAutomotive IndustriesCoatings for Cutting Tools
Solar PanelsLaser OpticsArchitectural Glass

Quken offers a variety of evaporation materials.

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