E-Beam, Electron Beam Evaporation, a thermal evaporation process, is a most common type of Physical Vapour Deposition (PVD) process. (Reference: Introduction of Physical Vapour Deposition and Thermal Evaporation VS Sputtering Deposition)
E-Beam Evaporation refers to the process in which the target used as a coating is bombarded by an electron beam from a charged tungsten filament, then vaporizes and converts it into a gaseous state. In a high vacuum chamber, gaseous atoms or molecules are deposited on the material to be coated to form a thin film coating.
Here are two significant advantages of E-Beam Evaporation:
- It is suitable for metals with high melting points, the deposition rates from 0.1 to 100nm/min allows it to produce a higher density film coating.
- E-Beam Evaporation has high utilization efficiency in a lower degree of contamination. Concentrating the energy on the targets helps reduce the possibility of heat damage to the substrate.
The applications of E-Beam Evaporation are included but not limited to the followings:
|High Performance Aerospace||Automotive Industries||Coatings for Cutting Tools|
|Solar Panels||Laser Optics||Architectural Glass|
Quken offers a variety of evaporation materials.